Electromechanical, Plastic Parts & Industrial Design

TEN TECH A&D's Mechanical Design Division specializes in Electromechanical Design and Packaging, providing expertise in the following areas:

• Avionics Packaging of Airborne Electronics
• ATR Equipment, ARINC 600 & 404 standards
• Electro-optical Systems
• Design Ruggedization
• Sheetmetal & Machined Parts
• Injection Molding Plastic Parts Design
• EMI Electromechanical Packaging
• Tolerance Analysis & ANSI-Y14.5 GD&T
• Harness & Cable Management Design
• Conceptual Design & Industrial Design
Mechanical Design
We have a vast amount of experience in the design of custom chassis utilizing dip and vacuum brazed methods as well as epoxy adhesive bonding for structural reinforcement and EMI prevention. TEN TECH A&D's design methods adhere to the most rigorous commercial and military specifications, including RTCA/DO-160, MIL-STD-810, MIL-STD-901 and MIL-STD-1472. Technical Data Packages we deliver are fully compliant with MIL-DTL-31000 standard.
TEN TECH A&D is officially a "VITA 48.7 Air Flow-By™" Design-capable Supplier.

Air Flow-By™ (AFB) is the ANSI/VITA 48.7-ratified open standard for the efficient cooling of OpenVPX™ processing systems. Over the past 6 years, TEN TECH A&D has gained in-depth knowledge of the AFB technology and its performance, working closely with Mercury Systems on its deployment on various manned and unmanned airborne platforms.

As a Design-capable Supplier of VITA 48.7 Air Flow-By™, TEN TECH A&D can assist in the design, conversion and performance evaluation of any OpenVPX™ modules and systems.
VITA 48.7 Air Flow-By™ Module
The engineers at TEN TECH A&D use the most advanced 2D & 3D CAD systems to perform complete Digital Design, including:

• 2D Drawings & Review Packages
• 3D Modeling for Parts, Assemblies
• Organic Shapes, Styling and Class-A Surfacing
• Point Cloud Processing & Reverse Engineering
• Generative Design for Additive Manufacturing
• Artistic & Realistic 3D Renderings
Generative Design Topology Optimization
RF-SiP Engineering
TEN TECH A&D supports the development of Advanced RF System-in-Package (RF-SiP) components. Our engineers bring expertise in many key areas of electronics components design & engineering, including:

• Substrate, Interposer & BGA material selections
• Interconnects Sizing (TSV, BGA pitch, …)
• Manufacturability & Reworkability
• Internal & External Thermal Management
• Integration into Higher-level Assemblies
• Harsh Environments Survivability
• Low & High Cycle Fatigue & Durability Prediction

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